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A-Laser Capabilities: Depanelling

Depanelling

Our laser depanelling process creates numerous benefits for our customers. The <20 micron beam size allows part spacing to be tighter, therefore creating significant material savings.  Additionally, customers can push right up to the edge of their board, as there is very little thermal influence and such high precision in our cuts (+/- .0005”).  Contact free laser processing ensures the integrity of your panels.